
New publication
Poster presentation at Microscopy Conference 2023 on "Using Machine Learning and Topographic SEM Imaging for Software Assisted Fractography"

Poster presentation at Microscopy Conference 2023 on "Using Machine Learning and Topographic SEM Imaging for Software Assisted Fractography"
M&A publication on "Geometrical Analysis in SEM". See full paper here: Geometrical Analysis in SEM
Poster contribution at Nanoscale 2019 with title: "Calibration of 3D reference standards using metrological large range AFM and calibrated confocal microscopy"
New publication at the 52nd Metallography Conference 2019 in Dresden with title In-situ Messung der 3D-Topografie von Bruchflächen im REM (in German). Data were recorded with DISS BSE-Topography system from point electronic GmbH.
M2C calibration technology is now integrated in Live-3D topography modul of DISS SEM control. The application of 3D calibration technology enables quantitative topography measurements with your SEM. All you need is DISS 3D topography extension for your SEM and an M2C calibration standard. Find further information on DISS 3D topography here.
All m2c products and services will continue under the point electronic GmbH ownership. The integration between high performance imaging and control electronics with expert geometrical calibration and automation greatly strengthens the 3D and topography techniques in SEM, as well as expanding into new metrology and surface science applications. For more information look here and on the point electronic website