m2c microscopy measurement & calibration m2c microscopy measurement and calibration

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Job offer
September 21, 2020

Job offer Software developer

We are hiring a full-stack software developer (C#, .NET) for our main office in Halle (Saale). We are looking forward to receive your application.

Job offer
Poster Nanoscale 2019
October 15, 2019

New publication

Poster contribution at Nanoscale 2019 with title: "Calibration of 3D reference standards using metrological large range AFM and calibrated confocal microscopy"

Poster Nanoscale 2019
DISS topography plugin with 3D calibration
October 23, 2018

3D calibration now integrated in DISS SEM control

M2C calibration technology is now integrated in Live-3D topography modul of DISS SEM control. The application of 3D calibration technology enables quantitative topography measurements with your SEM. All you need is DISS 3D topography extension for your SEM and an M2C calibration standard. Find further information on DISS 3D topography here.

DISS topography plugin with 3D calibration
m2c products and services will continue under the point electronic GmbH ownership
November 1, 2017

m2c now part of point electronic GmbH

All m2c products and services will continue under the point electronic GmbH ownership. The integration between high performance imaging and control electronics with expert geometrical calibration and automation greatly strengthens the 3D and topography techniques in SEM, as well as expanding into new metrology and surface science applications. For more information look here and on the point electronic website

m2c products and services will continue under the point electronic GmbH ownership
FIB roughness structure with size of 290 µm x 290 µm on flat Si-substrate (left), on cylindrical NiP surface with radius of about 400 µm (center) and NiP sphere with about 600 µm radius (right)
December 2, 2016

New roughness standards for high resolution measurement techniques

In cooperation with PTB (Physikalisch-Technische Bundesanstalt), m2c developed new roughness standards for high resolution surface measurement techniques. The desired roughness can be selected in an easy way and is used for the production with Focussed Ion Beam (FIB). Repeated profiles, well-known in 2D roughness measurement techniques, are also suitable for this processing technology. For more information, see: PTB Forschungsnachrichten

FIB roughness structure with size of 290 µm x 290 µm on flat Si-substrate (left), on cylindrical NiP surface with radius of about 400 µm (center) and NiP sphere with about 600 µm radius (right)